High-density quantum processor connectivity

Project funded by Swedish Governmental Agency for Innovation Systems (Vinnova) (Project grant), grant 2022-02849_Vinnova. Participating organisations named by the source: SCALINQ AB. Funded amount: SEK 815,000, as stated by the source. Runs 2022-11-15 to 2023-10-15. Keywords: Teknik, Engineering and Technology, Elektroteknik och elektronik, Electrical Engineering, Electronic Engineering, Information Engineering. Source: OpenAIRE Graph, from the funder's project data (collected by OpenAIRE on 2025-12-04); national funding data, not CORDIS. Abstract given by the source: Purpose and goal: The purpose and goal of the project was to develop a concept for microwave packaging of quantum chips that is able to scale from hundreds to thousands of signal lines. The concept also had enable mounting of the chip in an easy and time-efficient manner, while providing state-of-the-art connectivity performance. Expected results and effects: The result of the project was a MVP of the proposed koncept. The results have laid a foundation to a functioning solution and a prototype that we will continue iterating on in order to create a final products. This is also the expected effect of the project. Approach and implementation: The project consisted of electrical development and validation, mechanical development and validation, as well as investigations and establisihing relevant manufacturing processes. The list of requirements was valiated externally and iterated during the project. The completion of the project went well, although prototyping took longer time than expected, for eaxample due to long lead times on material. The concepts were validated continously upon each iteration, which led to very valuable insight early in the development phase.

Original source.

Source: OpenAIRE Graph: projects of national funders, OpenAIRE, from the project data of Swedish Governmental Agency for Innovation Systems (Vinnova). Retrieved 2026-10-22. Licence: Creative Commons Attribution 4.0 (OpenAIRE Graph). Selected metadata, adapted presentation; the publisher's record is authoritative. No endorsement by the source is implied. Licence: Creative Commons Attribution 4.0 (CC BY 4.0).

AI-assisted summary: The project, funded by Vinnova with a grant of SEK 815,000, aims to develop a microwave packaging concept for quantum chips to enhance connectivity. It runs from November 15, 2022, to October 15, 2023, and involves SCALINQ AB. Suggested technology pillar: computing. Generated by AI from the public source text; it may contain errors and the original source is authoritative.