Draft SRIA 2026 overview / Industrial roadmaps
Treats cryogenics, control electronics, photonics and chip manufacturing as strategic control points; plans dependency mapping by 2027, capability building to 2030 and industrialisation to 2035, with European sourcing targets of 30% and 60%.
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Goal strategic objective for 2035
Open strategic autonomy: future quantum systems cannot be built, deployed and integrated at scale without substantial European enabling technologies, infrastructures and suppliers.
What the portal shows today
Technologies: Enabling technologies and supply chain
Confirmed items on the portal, each counted once.
Milestone 2027 review milestone
A dependency map across computing, communication and sensing validated by at least ten European system developers with SME representation; an operational monitoring function; documented KPI baselines and first benchmarks.
What the portal shows today
Technologies: Enabling technologies and supply chain, Cryogenics and cooling, Control electronics, Photonics, lasers and optics
Confirmed items on the portal, each counted once.
Milestone 2030 review milestone
At least 30% European sourcing across priority categories, and two qualified sources for each critical component or a documented mitigation plan.
What the portal shows today
Technologies: Enabling technologies and supply chain
Confirmed items on the portal, each counted once.
Milestone 2030 review milestone
An EU-designed quantum control chipset at TRL 5.
What the portal shows today
Technologies: Control electronics
Confirmed items on the portal, each counted once.
Milestone 2030 review milestone
At least 3 EU cryogenic testing providers with an aggregate of at least 100 chips a month, indicative photonic yield of at least 50%, and space and defence qualification protocols demonstrated.
What the portal shows today
Technologies: Cryogenics and cooling, Photonics, lasers and optics
Confirmed items on the portal, each counted once.
Goal 2035 review milestone
At least 60% European sourcing, at least 3 evidenced European control points, no unmitigated critical single-source dependencies and 10% relative market-share growth.
What the portal shows today
Technologies: Enabling technologies and supply chain
Confirmed items on the portal, each counted once.
Goal 2035 KPI
At least 3 EU foundries offering QT-grade fabrication as a commercial service, indicative device yield of at least 70% and photonic process yield of at least 80%.
What the portal shows today
Technologies: Quantum chips, materials and fabrication, Photonics, lasers and optics
Confirmed items on the portal, each counted once.
| Objective and indicator | 2026 baseline | 2030 target | 2035 target | Page |
|---|---|---|---|---|
| Objective 1: Scalable European quantum chip and device manufacturing Fabrication capacity, yield and access | Phase 1 baseline: qualified fabrication capacity, process reproducibility, turnaround times and yields; materials/substrates, equipment, packaging and access conditions mapped | Industrial fabrication and packaging capacity expanded; process-specific yield and turnaround-time baselines reported; qualification actions for priority materials/substrates and manufacturing equipment; clear industrial access conditions | ≥3 EU foundries offering QT-grade fabrication as a commercial service; indicative device manufacturing yield ≥70% against defined criteria; sustained production capacity and reproducibility reported | 124 |
| Objective 2: Scalable cryogenic infrastructure and testing Cryogenic supply and testing capacity | Application-specific baseline of cryogenic supply, including 300 K → 4 K and sub-kelvin stages; qualification gaps and test throughput/turnaround measured | Application-specific cooling alternatives benchmarked and qualified where suitable; two qualified sources per critical component or documented mitigation; commercial cryogenic testing at ≥3 EU providers, ≥100 chips/month aggregate with stated test scope | Diversified cooling capability; three European suppliers in selected categories where demand supports them; cryogenic testing capacity and turnaround matched to pilot-line needs | 124 |
| Objective 3: European control, readout electronics and high-density I/O Control chips and I/O | European control-electronics and design-toolchain baseline defined; ASIC, CMOS, superconducting and optical/hybrid approaches assessed by application; upstream dependencies mapped | EU-designed control chipset at TRL 5; application-specific qualification of control, readout and high-density electrical/optical I/O; noise, power, density and cost measured | EU-designed control chips commercially available; qualified scalable control/readout and I/O solutions adopted; general 60% European-sourcing target applies across priority categories | 124 |
| Objective 4: Photonics, optical components and photonic manufacturing Optical components and photonic yield | Capacity and dependency baseline for optical sources/detectors, lasers, nonlinear materials, visible/UV processes and integrated photonics; non-cryogenic benchmark selected | Qualification milestones for priority optical and network-enabling components; two qualified sources per critical component or mitigation; indicative photonic process yield ≥50% against defined criteria | Industrial-grade optical components and integrated modules; three European suppliers in selected categories where viable; indicative photonic process yield ≥80% against defined criteria | 124 |
| Objective 5: Strategic European capabilities and dependency mitigation European sourcing and control points | Validated baseline of European control points, qualified-source coverage and unmitigated critical dependencies; procurement-value sourcing baseline established | ≥30% European sourcing across priority categories; two qualified sources per critical component, prioritising EU alternatives, or a documented mitigation plan; European control points tracked | ≥60% European sourcing; ≥3 evidenced European control points; no unmitigated critical single-source dependencies in priority categories, irrespective of geography; selected three-EU-supplier ambitions tied to demand | 125 |
| Objective 6: Supply-chain intelligence and early warning Monitoring and early warning | Dependency map and monitoring function established in Phase 1; coverage, lead times, qualification status and bottleneck-detection baseline documented | All defined priority categories monitored; category coverage, lead times and qualification status updated; ≥6 emerging critical bottlenecks identified before deployment impact, with evidence | Continuous monitoring of all priority categories; same coverage, lead-time and early-warning measures retained; emerging risks and mitigation progress reviewed regularly | 125 |
| Objective 7: Design for circularity Design for disassembly and reuse | Baseline: design-for-disassembly in ≥1 pilot-line product family and ≥1 cross-sector recovery/reuse pilot, subject to validation; priority materials and equipment selected | Design-for-disassembly in ≥3 product families and ≥3 recovery/reuse pilots; recovery efficiency, reuse and refurbishment outcomes reported against programme baselines | Refurbishment/take-back schemes operating for priority long-lived equipment; qualified recovery/reuse routes for selected materials and components where technically and economically feasible, with measured outcomes | 125 |
| Objective 8: Market uptake of European enabling technologies Global market share per priority category | Phase 1 establishes a documented 2026 global market-share baseline per priority category, with market definition, revenue basis, data sources and supplier eligibility stated | 5% relative increase in market share per priority category versus the documented baseline (baseline × 1.05) | 10% relative increase in market share per priority category versus the documented baseline (baseline × 1.10) | 125 |
Read-only figures of this portal, for orientation; they are not SRIA figures and do not measure progress against the draft.
Technology hubs: Enabling technologies and supply chain, Cryogenics and cooling, Photonics, lasers and optics, Control electronics, Quantum chips, materials and fabrication
People with recent published works in the matching technology families, from open sources (OpenAlex). Professional information only.